ASM E by DEK Stencil Solder Paste Printer Specifications
| Machine Performance | Specification |
| Alignment | > 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
| System alignment capability | > 2.0 Cmk @ ± 25 μm (± 6 sigma) |
| Optimum core cycle time | 8 seconds |
| Substrate size | 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) |
| Operating System | Windows 7 Embedded |
| Squeegee pressure mechanism | Software-controlled, motorised with closed loop feedback |
| Stencil positioning | Semi-auto stencil load with drip tray |
| Under stencil cleaning | Interchangeable under stencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe |
| Adjustable-width stencil mount (AWSM) | Frame variants – fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm |
| Substrate thickness | 0.2 mm to 6 mm |
| Substrate weight (maximum) | 6 kg |
| Substrate warpage | Up to 7 mm including substrate thickness |
| Substrate fixture | Over the top clamps Edge clamps Foil-less clamps Vacuum |
| Temperature & humidity sensor | Monitoring of the process environment |
