Features
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Shadow-Free 3D Inspection
Advanced Moiré technology with dual projection eliminates shadow effects for highly accurate solder paste inspection. -
Real-Time Warp Compensation (2D + 3D)
Combines pad referencing and Z-tracking to ensure stable inspection on warped PCBs. -
User-Friendly Interface
Intuitive renewed GUI with real-color 3D images for easier operation and clearer inspection results. -
Flexible Inspection Range
Supports up to 2mm height inspection (optional), covering a wide variety of solder paste applications. -
3D Foreign Material Detection (Optional)
Detects and analyzes foreign materials on PCBs using 3D data for enhanced quality control.
Technical Parameters
Specifications
